Publikationen
Konferenzpaper
- A. Diepenbrock, J. Fleck, and S. Sachweh, “An analysis of stack exchange questions,” ARES ’23: Proceedings of the 18th International Conference on Availability, Reliability and Security. Association for Computing Machinery, New York, NY, USA, pp. 1–7, 2023.
- J. Fleck, J. Sorgalla, F. Katzenberg, and S. Sachweh, “A Containerized Template Approach for Vendor-Friendly Smart Home Integration,” 2023 IEEE 12th International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS). IEEE, Piscataway, NJ, pp. 352–355, 2023.